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Product Type : Rigid PCB 

Layer Count : S/S, D/S and M/L

Material : FR4, CEM3, High TG, Ceramic

Surface Treatment : HASL, Ni/Au, Entek

Soldermask : LPI, Silkscreen, Peelable 

Smallest Hole Size : 0.30 mm 

Hole Type : PTH / Blind Via / Buried Via

Mini Line Width/Space : 0.100 mm / 0.100 mm

Copper Thickness : 18 um to 400 um
                                ( 0.5 oz to 11.5 oz )

Outline Profile : Routing or Punching

Packing : Vacuum pack with silica gel
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